ap210-research-data

AP210 Research Data Archive

Comprehensive research datasets for ISO 10303-210 (AP210) Electronic Assembly, Interconnect and Packaging Design applications.

Principal Organizations

• NIST (National Institute of Standards and Technology)
• PDES Inc.

Available Datasets

NIST Research Projects

• nist-ap210-cfd/ - Computational Fluid Dynamics project data
• nist-ap210-gdt/ - Geometric Dimensioning & Tolerancing projects (connectors and packages)
• nist-ap210-spice/ - SPICE circuit simulation integration project data

PDES Inc. Projects

• pdes-ap210viewer/ - AP210 visualization and viewing tool data
• pdes-idf2ap210/ - IDF to AP210 conversion project data

Documentation

• documentation/ - Data dictionaries, methodologies, and technical documentation

Usage and Citation

This dataset is released under Creative Commons Attribution 4.0 International License (CC-BY 4.0).

When using this data, please cite:

NIST, PDES Inc. AP210 Research Data Archive. 
https://github.com/expresslang/ap210-research-data
DOI: https://doi.org/10.5281/zenodo.16496290

Related Resources

• Main Project Site: ap210.org
• Research Project Descriptions: ap210.org/research

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This research data archive provides materials for advancing the state of electronic design automation and standards-based data exchange in the electronics industry.

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